常用集成电路的封装形式
常用集成电路的封装形式
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常用集成电路的封装形式 | ||
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CLCC
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DIP Dual Inline Package
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DIP-tab Dual Inline Package with Metal Heatsink
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FBGA
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FDIP
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FTO220
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Flat Pack
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HSOP28
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ITO220
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ITO3p
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JLCC
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LCC
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LDCC
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LGA
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LQFP
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PCDIP
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PLCC
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PQFP
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PSDIP
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LQFP 100L
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METAL QUAD 100L
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PQFP 100L
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QFP Quad Flat Package
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SOT143
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SOT220
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SOT223
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SOT223
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SOT23
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SOT23/SOT323
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SOT25/SOT353
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SOT26/SOT363
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SOT343
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SOT523
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SOT89
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SOT89
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LAMINATE TCSP 20L Chip Scale Package
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TO252
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TO263/TO268
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SO DIMM Small Outline Dual In-line Memory Module
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QFP Quad Flat Package
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TQFP 100L
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SBGA
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SC-70 5L
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SDIP
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SIP Single Inline Package
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SO Small Outline Package
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SOJ 32L
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SOJ
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SOP EIAJ TYPE II 14L
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SOT220
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SSOP 16L
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SSOP
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TO18
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TO220
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TO247
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TO264
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TO3
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TO5
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TO52
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TO71
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TO72
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TO78
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TO8
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TO92
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TO93
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TO99
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TSOP Thin Small Outline Package
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TSSOP or TSOP II Thin Shrink Outline Package
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uBGA Micro Ball Grid Array
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ZIP Zig-Zag Inline Package
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BQFP132
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TEPBGA 288L
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TEPBGA 288L
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C-Bend Lead
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CERQUAD Ceramic Quad Flat Pack
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Ceramic Case
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Gull Wing Leads
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J-STD
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J-STD Joint IPC / JEDEC Standards
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JEP
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JEP JEDEC Publications
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JESD
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JESD JEDEC Standards
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LLP 8La
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PCMCIA
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PDIP
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PLCC
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PS/2
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PS/2 mouse port pinout
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SIMM30
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SIMM30 Pinout
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SIMM72
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SIMM72 Pinout
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SNAPTK
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SNAPTK
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SNAPZP
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SOH
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